Looking for high reliability but also want a compact, smaller and cheaper unit?

Chip and Wire
Many applications demand that electronic modules be lightweight, of minimum volume, consuming little energy, and meeting rigorous performance and reliability standards as well as clearly defined cost goals.

Chip & Wire Facilities
– Al and Au wire bonding – Fine and heavy wire
– Ribbon bonding for RF applications
– Die attach and bonding
– CSP and flip chip

Investments for the Future
Multichip Modules from Kitron Microelectronics have proven they can meet the industry’s needs for more than two decades. To satisfy the increased market demand, Kitron Microelectronics has made major investments so that they can now offer a package of services that is more comprehensive than ever.

High Reliability
MCM’s from Kitron Microelectronics offer solutions that ensure the most cost-effective approach where reliability is a key requirement.

Want to know more about Chip & Wire and different MCM technologies? Load our brochure here: